Automatic inspection of 2D and 3D wafers for wafer processing and bump bonding.
From manual sensory appearance inspection by humans to fully automated inspection by equipment! Introducing complete traceability.
Our company provides semiconductor package services, including wafer processing and 2D + 3D automatic inspection for bump bonding wafers. We are capable of conducting 100% inspection by combining 2D (chip surface condition/dicing condition inspection) and 3D (bump bonding measurement) technologies. We offer a consistent response from wafer acceptance inspection to post-inspection, implementing complete traceability. 【Features】 ■ Consistent manufacturing and inspection line ■ Complete traceability ■ Ability to differentiate between wafer-related and process-related issues ■ Prevention of defective products flowing into subsequent processes *For more details, please feel free to contact us.
- Company：エスタカヤ電子工業
- Price：Other
